India and US Collaborate on National Security Semiconductor Fabrication Plant
| Aspect | Details |
|---|---|
| Collaboration | India and the United States collaborate to launch India's first national security semiconductor fabrication plant. |
| Purpose | To produce chips for military applications and critical telecommunications. |
| Announcement | Announced during talks between PM Narendra Modi and US President Joe Biden in Wilmington during PM's US visit. |
| Stakeholders | India Semiconductor Mission, Bharat Semi, 3rdiTech, and the US Space Force. |
| Facility Type | World's pioneering multi-material fab focused on national security. |
| Semiconductors to be Produced | Infrared, gallium nitride, and silicon carbide semiconductors. |
| Significance | Comparable to the civil nuclear agreement; first US military partnership with India for high-value technologies. |
| Joint Statement | Focus on advanced sensing, communication, and power electronics for national security, telecommunications, and green energy. Additional efforts to build resilient semiconductor supply chains and 5G cooperation. |
| India Semiconductor Mission | Launched in 2021 with an outlay of Rs 76,000 crore; part of efforts to develop sustainable semiconductor and display ecosystems in India. |
| New Semiconductor Projects | Dholera Special Investment Region (DSIR), Gujarat: Rs 91,000 crore. Morigaon, Assam: OSAT facility. Sanand, Gujarat: OSAT facility. |